Murata LBEE5PL2DL Multiprotocol Module
Murata LBEE5PL2DL Multiprotocol Module is a Type 2DL Wi-Fi® + Bluetooth® module that supports IEEE 802.11a/b/g/n/ac/ax + Bluetooth 5.3 BR/EDR/LE specifications. This small and high-performance LBEE5PL2DL module is based on NXP’s IW611 combo chipset. The LBEE5PL2DL Wi-Fi + Bluetooth module features SISO with 20MHz, 40MHz, and 80MHz channels and supports up to MCS11 601Mbps data rates. This multiprotocol module includes SDIO 3.0 WLAN interface and an HCI UART Bluetooth interface for better performance. The LBEE5PL2DL module operates at -40°C to 85°C temperature range and 1.71V to 3.46V supply voltage range. This module is RoHS compliant and comes in 8.8mm x 7.7mm x 1.3mm dimensions.
FEATURES
- NXP IW611 inside
- Supports IEEE 802.11a/b/g/n/ac/ax specifications
- Supports dual band 2.4GHz and 5GHz
- SISO with 20MHz, 40MHz, and 80MHz channels
- Up to MCS11 601Mbps data rates
- Supports Bluetooth specification version 5.3
- For supported Bluetooth functions, refer to Bluetooth SIG site
- SDIO 3.0 WLAN interface
- HCI UART Bluetooth interface
- -40°C to 85°C operating temperature range
- Dimensions: 8.8mm x 7.7mm x 1.3mm
- Weighs about 0.22g
- Moisture Sensitivity Level-3 (MSL-3)
- Surface-mount type
- RoHS compliant
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