Wolfspeed's WolfPACK baseplate-less silicon carbide power modules increase efficiency and power density in a compact, industry-standard footprint. The modules come in SiC MOSFET half-bridge, six-pack, and full-bridge configurations with a variety of mΩ options. All configurations are available with the option of pre-applied thermal interface material.

Compared to multiple discrete devices, the modules offer a more compact unit with highly reliable press-fit connections, deliver higher ampacity through an isolated backside, and provide an excellent solution for fast design implementation, scalability, and lower assembly overhead.

Wolfspeed also provides a complete ecosystem of tools to build designs, including dynamic evaluation boards to evaluate the performance of the modules under many application conditions along with gate driver options and a variety of helpful tools to ensure the required flexibility.